High speed, accurate solidification capacity ±10um@3σ;
High production efficiency, low cost input;
High multi-chip processing capacity, support 16 different types of chip placement; High flexibility to support multiple carrier operations;
Can work in different plane heights, support deep cavity work;
Modular platform design, small appearance,small footprint。
Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips.
General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes.
The Chip Bonder is used for multi-chip placement, with mature technology application platform, which offffers higher accuracy with new camera system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture.