Sintering Die Bonder is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achieving the presintering bonding of electric components for high precision heating system.
High speed, accurate solidification capacity ±10um@3σ;
High production efficiency, low cost input；
High multi-chip processing capacity, support 16 different types of chip placement； High flexibility to support multiple carrier operations；
Can work in different plane heights, support deep cavity work；
Modular platform design, small appearance,small footprint。
Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips.
General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes.
The Chip Bonder is used for multi-chip placement, with mature technology application platform, which offffers higher accuracy with new camera system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture.
