Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips.
IC Bonder CBD2200:
Special use type high precision IC bonder, It is suitable for a variety of small batch of placing products, automatically switch to a variety of mounting head, quickly achieve to place a variety of chip with different. It is mainly used in the military products RF and power module power amplifier.
Features:
1. Supermini chip placement
2. Ultrathin Die Bonding Technology
3. Automatic nozzle change
4. Bottom photo-taking, high precision placement
5. Quick Changeover
| Item | Specification |
| Placement accuracy | ±10um@3σ |
| Placement angle accuracy | ±0.3°@3σ |
| Loading mode | Wafer box |
| Die size(mm) | 0.25*0.25mm-10*10mm |
| PCB size(mm) | L300*W100 |
| Placement head | 0-360°rotation/Auto change nozzle(option) |
| Placement pressure(N） | 30-500g |
| Glue feeding mode | Support: dispensing, dipping, painting |
| Core motion module | Linear motor + grating scale |
| Platform base of machine | Marble platform |
| Machine dimension(L×W×H) | 1610mm×1380mm×1620mm |
| Remarks:Customization is supported | |
