Sintering Die Bonder is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achieving the presintering bonding of electric components for high precision heating system.
Sintering Die Bonder:
It is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achieving the presintering bonding of electric components for high precision heating system.
Features:
Die bonding ability with high speed and high accuracy
Placement head and platform with heating function
Temperature control system with high accuracy
Accurate force control system
Wafer loading support
Automatic nozzle change
Automatic pin base change
Compact structure and small occupying area
Main application:
Presintering die bonder is suitable for IGBT, SiC, DTS, resistance and other high temperature presintering processes. It is mainly used in power module, power supply module, new energy, smart grid and other industry areas.
| Item | Specification |
| Placement accuracy(um) | ±10 |
| Rotation accuracy(@3sigma) | ±0.15° |
| Placement angle deviation | ±1 ° |
| Placement Z axis force control(g) | 50-10000 |
| Force control accuracy(g) | 50-250g,repeatability±10g; 250g-8000g,repeatability±10% ; |
| Placement head heating temp | Max.200℃ |
| Placement head rotation angle | Max.345° |
| Placement heat cooling | air/nitrogen cooling |
| Chip size(mm) | 0.2*0.2～20*20 |
| Wafer size(inch) | 8 |
| Placement workbench heating temp | Max.200℃ |
| Placement workbench heating zone temp deviation | <5℃ |
| Placement workbench available size(mm) | 380×110 |
| Max.Placement head XYZ axis stroke(mm) | 300x510x70 |
| Equipment repaceable nozzle number | 5 |
| Equipment replacement Pin module number | 5 |
| PCB loading method | Manual |
| Wafer loading Method | Semi-auto(manually place wafer cassette,automatically take wafer) |
| Core motion module | Linear motor+grating scale |
| Machine platform base | Marblep latform |
| Machine main body dimension(L×W×H,mm) | 1050X1065X1510 |
| Equipment net weight | Approx.900kg |
