The snap curing oven adopts modular design and combines different functions,
like automatic temperature control, nitrogen protection, buffer cooling, automatic
loading and unloading and so forth. Through the specific temperature control,
atmosphere control and automatic operation, it can complete the process after
Die Attach equipment, which is mainly used in curing and bonding of semi-conductor packaging.
The semiconductor oven with nitrogen filled has strong universality, high stability and high performance. It adopts high capacity horizontal air recycling system, adopts special chamber structure and sealing technology, with excellent air tightness and temperature uniformity to meet the high performance requirements of semiconductor products. This oven is suitable for curing semiconductor wafers, IC packages (copper substrate, silver gel, silica gel, epoxy resin), glass substrate and other products.
