Small Selective Soldering


Integrated spray/preheat/welding function;

High quality nozzle, easy to remove and replace;

Independently developed electromagnetic pump, stable wave;

Compact design, small footprint, energy saving;

Quick Changeover.

Small Selective Soldering SUNFLOW FS Feature:

Equip with spraying, preheating and welding units which can complete the whole welding process in a small machine;

Rotary track design which allows loading and unloading PCB on the same side of the machine;

Cover small area, shorter than the standard SUN FLOW machine;

Realtime monitoring and recording of welding process.

Basic machine module:

·Flux Module

·Preheat Module

·Soldering Module(within ner6mm nozzle)

·Conveyor System

Working Process:After PCB is moved to flux area, the spray head is targeted to the programed position and the flux is applied only to the solder joint to be made.After preheating, the electromagnetic pump moves to the target area and solder joint is made.

Conveying system:

Sunflow FS transmission system adoption a roller conveyor, increase welding space,better close to the edge components of welding

Fluxing with high precision:

The SUN FLOW FS standard machine adopts precise nozzle with 130um diameter which is imported from Germany and can uniformly spray flux in the required welding area.The minimum injection area is3mm which saves atleast 90%flux compared with the traditional spraying.

All the movements are drive d by servomotor.The movements are stable and smooth.The precision accuracy is around 0.05mm.

Stable high quality soldering:

Sunflow FS offers electromagnetic pum system.There is no moving mechanical parts in pump system, so dust is little in process.The pump offer constant flow which translates into stable wave height.The soldering module has high precision axis system to ensure the accurate soldering path and with particular process, the system will eliminate the chance of bridging.Besides, process monitor screen and automatic soldering wave height detecting are very friendly for users.

Feature and advantage

·Wave stability

·Quick-changes older nozzles 

·High quality nozzle(can use 3 months)

·Small occupation space

·Energy saving

·Line change fast

Fast and comfortable programing:

1.Gerber file program

2.On-line screen program

3.Picture program

4.MARK plsitinoning and recognition (Option)

ParametersDescriptionDetailed parameters
General ParametersOverall dimension(mm) (Not include the keyboard, indicator light and monitor)1435(L)*1800(W)*1670(H)
Equipment Weight(kg)Approx.1050
PCB Top Side Clearance(mm)120
PCB Bottom Side Clearance(mm)60
PCB process edge(mm)≥3
Conveyor Height From Floor(mm)900±20
PCB Conveying Speed(m/min)0.2-10
Max PCB Weight(kg)≤5
PCB Thickness With Jig(mm)1-6
Conveyor Width Adjustment Range(mm)50-450
Conveyor Width Adjustment ModeElectric
PCB Conveying DirectionLeft to right
Air Input Pressure(Mpa)0.6
Nitrogen SupplyOffered by customer
Nitrogen Input Pressure(Mpa)0.6
Nitrogen Consumption(m³/h)1.5
Required Purity of Nitrogen(%)≥99.999
Supply Voltage(VAC)380
MaxPower Consumption(kw)<12
Max Current(A)<25
Ambient Temperature(℃)10-35
Machine Noise Level(dB)<65
Communication InterfaceSMEMA
Soldering SystemMax.Soldering distance of Xaxis(mm)510
Max.Soldering distance of Yaxis(mm)450
Max.Soldering distance of Z axis(mm60
Min outer diameter of nozzle(mm5.5
Nozzle inner diameter(mm)2.5-10
Max soldering wave height(mm)5
Solder pot capacity(kg)Approx.13kg(Sn63pb)/Approx.12kg(lead-free)
Max soldering temperature(℃)330
Soldering heating power(kw)1.15
Preheating SystemPreheat temperature range(℃)<200
Heating power(kw)6
Top side preheatingHotair
Spraying SystemMax.stroke of Xaxis(mm)510
Max.stroke of Yaxis(mm)450
Spray height(mm)60
Location speed(mm/s)<200
Fluxbox capacity(L)2

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