High speed, accurate solidification capacity ±10um@3σ;
High production efficiency, low cost input；
High multi-chip processing capacity, support 16 different types of chip placement； High flexibility to support multiple carrier operations；
Can work in different plane heights, support deep cavity work；
Modular platform design, small appearance,small footprint。
| Item | Specification |
| Placement accuracy | ≤+10um@3σ |
| Placement angle accuracy | ±0.15°@3σ |
| Force control range | 20~1000g(with different configurations,the maximum support is 7500g) |
| Force control accuracy | 20g-150g:±2g; 150g-1000g:±5% |
| Substrate pallet size(mm) | L200XW90~150 |
| Tray size(mm) | Based on customer products |
| Loading/Unloading | Manual /auto |
| IC dimension(mm) | L0.25*W0.25-L10*W10 |
| IC supply | Waffle tray |
| Core module movement mode | Linear motor+grating scale |
| Glue feeding mode | Dispensing+painting glue |
| Auto change nozzle | Seven |
| Bottom photo-taking | Equipped with camera |
| Machine dimension(mm) | L(1400)*W(1250)*H(1700) |
| Weight | Net weight of equipment:Approx.1500Kg |
| Remarks:Customization is supported | |
