The highly anticipated NEPCON Intelligent Manufacturing Innovation Conference - Shanghai Semiconductor Session was held on October 16, 2024. Centering on SiP and advanced semiconductor packaging and testing technologies as well as power semiconductor technologies and applications, the event drew numerous industry leaders and technical experts. Invited to the conference, Suneast displayed its independently developed semiconductor packaging equipment, namely IC bonder, pre-sintering bonder, semiconductor oven and fast curing oven. The company delivers reliable equipment solutions for semiconductor packaging processes and demonstrates its strong strength in technological innovation.
From September 25 to 27, 2024, Suneast participated in CSEAC Annual Conference & the 12th Exhibition of Semiconductor Equipment, Materials and Core Components held at Wuxi Taihu International Expo Center. Innovative achievements and cutting-edge products were showcased, fully demonstrating the development progress and innovative exploration of China's integrated circuit industry in equipment, core components and key materials.
On July 24, 2024, Suneast was invited to attend the NEPCON Automotive Electronics Intelligent Manufacturing Innovation Conference held in Shanghai. The conference focused on three mainstream themes: intelligent cockpit, autonomous driving and motor electronic control. Industry elites gathered at the event, where Suneast showcased its latest products, dual-pump independent lifting selective wave soldering machine and multi-module combined selective wave soldering machine.
From May 22 to 24, 2024, the 26th CICD Integrated Circuit Manufacturing Annual Conference and Supply Chain Innovation Development Summit was grandly held at Guangzhou Knowledge City International Convention and Exhibition Center. With the theme of advancing industrial innovation and building an independent industrial ecosystem, the event gathered government officials, distinguished entrepreneurs, scholars and industry experts worldwide. It facilitated industrial development promotion, industry information release and enterprise cooperation exchanges through summit forums, roundtable meetings, themed seminars and exhibitions.
NEPCON China 2024 will grandly kick off at Shanghai World Expo Exhibition & Convention Center from April 24 to 26. Covering electronic components, semiconductor packaging and testing, circuit board assembly and smart factory management, the event builds a full-process exhibition platform spanning the whole industrial chain, presenting a comprehensive view of surface mounting technology.
From March 20 to 22, 2024, the three-day Productronica China concluded successfully at Shanghai New International Expo Centre. The exhibition showcased technological advances and product trends across the electronic manufacturing industry chain, as well as the development ecosystem and competitive landscape of the electronics sector.
