Suneast Wuxi CSEAC Semiconductor Equipment Exhibition Concludes Successfully | Shenzhen Bay Chip Exhibition, Oct 16-18 - Exhibitions

From September 25 to 27, 2024, Suneast participated in CSEAC Annual Conference & the 12th Exhibition of Semiconductor Equipment, Materials and Core Components held at Wuxi Taihu International Expo Center. Innovative achievements and cutting-edge products were showcased, fully demonstrating the development progress and innovative exploration of China's integrated circuit industry in equipment, core components and key materials.

Suneast displayed its newly developed semiconductor packaging equipment at the exhibition. The company keeps pursuing innovation in this field. Its self-developed IC bonder and pre-sintering bonder have realized domestic substitution in high-precision chip mounting. The newly launched semiconductor oven and fast curing oven deliver reliable baking, curing and bonding processes for semiconductor packaging production.

Two new products of Suneast made their debut at the exhibition.The SDB200 pre-sintering bonder targets the power semiconductor chip mounting market, equipped with an upgraded Bondhead system. It features high-precision bonding with accuracy of ±10μm, as well as pressure holding and heating functions. Matched with a high-precision heating system, it realizes pre-sintering bonding of electronic components.

Applicable to high-temperature pre-sintering processes of IGBT, SiC, DTS and resistors, the machine is widely used in power modules, power supply modules, new energy, smart grid and other fields.

The SEO-600N fast curing oven integrates automatic temperature control, nitrogen protection, buffer cooling and automatic loading and unloading functions. Its maximum baking temperature reaches 250℃, catering to diverse product temperature requirements, with temperature deviation of each heating module controlled within ±5℃. It completes post-bonding procedures via precise temperature, nitrogen and automatic operation, mainly applied to curing and bonding processes in semiconductor packaging.

China's semiconductor industry structure keeps optimizing and the industrial chain gradually improves, with particularly rapid growth in semiconductor packaging equipment. Suneast pursues innovation in this sector, continuously launching new products and technologies to advance domestic production of semiconductor equipment.

We will attend the Shenzhen Bay Semiconductor Industry Ecology Expo from October 16 to 18, 2024. Your presence is warmly welcomed!