Suneast Shines at NEPCON Intelligent Manufacturing Innovation Conference - Shanghai Semiconductor Session - Exhibitions

The highly anticipated NEPCON Intelligent Manufacturing Innovation Conference - Shanghai Semiconductor Session was held on October 16, 2024. Centering on SiP and advanced semiconductor packaging and testing technologies as well as power semiconductor technologies and applications, the event drew numerous industry leaders and technical experts.

Invited to the conference, Suneast displayed its independently developed semiconductor packaging equipment, namely IC bonder, pre-sintering bonder, semiconductor oven and fast curing oven. The company delivers reliable equipment solutions for semiconductor packaging processes and demonstrates its strong strength in technological innovation.

Suneast keeps advancing in the semiconductor equipment sector. Going forward, adhering to the values of co-creation, sharing, commitment and inheritance, the company will continuously explore new technological frontiers of intelligent equipment, strive to deliver greater value for clients and boost sound industrial development.