Suneast Invited to Attend the 26th CICD Integrated Circuit Manufacturing Annual Conference - Exhibitions

From May 22 to 24, 2024, the 26th CICD Integrated Circuit Manufacturing Annual Conference and Supply Chain Innovation Development Summit was grandly held at Guangzhou Knowledge City International Convention and Exhibition Center. With the theme of advancing industrial innovation and building an independent industrial ecosystem, the event gathered government officials, distinguished entrepreneurs, scholars and industry experts worldwide. It facilitated industrial development promotion, industry information release and enterprise cooperation exchanges through summit forums, roundtable meetings, themed seminars and exhibitions.

At the conference, Suneast showcased its self-developed and manufactured semiconductor packaging equipment, namely IC bonding machine and semiconductor oven. The firm provides localized equipment solutions for chip mounting, baking and packaging curing. Industry professionals are warmly welcomed to visit Booth No.51 for exchanges.

The WBD2200 PLUS IC bonder is a universal high-precision model. Designed for mass wafer feeding and mounting, it applies to SiP packaging, memory stack die, CMOS and MEMS processes, widely serving automotive electronics, medical electronics, optoelectronics and mobile phone industries.

The SEO series nitrogen-filled semiconductor ovens from Suneast feature strong versatility. Nitrogen injection expels oxygen inside the chamber to avoid oxidation under high baking temperatures.Equipped with a high-capacity horizontal air recirculation system and proprietary chamber structure & sealing technology, the equipment boasts excellent air tightness and temperature uniformity. It meets high-performance standards of semiconductor products, ideal for baking and curing semiconductor wafers, IC packages (copper substrates, silver glue, silica gel, epoxy resin) and glass substrates.