Technology Powers the Future | Event on Advanced Packaging and Testing Equipment Solutions and Application Cases Concludes Successfully - Exhibitions

Advanced packaging serves as a core track for the semiconductor industry to break performance bottlenecks and gain competitive edges. High-end equipment acts as a cornerstone driving technological upgrades and domestic substitution in this field.

On May 22, Suneast jointly held a special event themed Advanced Packaging & Testing Equipment Solutions and Application Cases in Suzhou, together with Shenzhen Polytechnic University, Ruinace and Zhuxin Microelectronics. The event gathered industry experts, enterprise representatives and practitioners. Featuring cutting-edge technology sharing and corporate practical exchanges, participants explored innovation approaches for advanced packaging and opportunities for domestic equipment development. It facilitated industrial resource connection, built a platform for in-depth communication and collaborative innovation, and injected new momentum into high-quality growth of the semiconductor sector.

From 8:30 in the morning, guests engaged in semiconductor packaging, equipment manufacturing and other related fields arrived one after another for registration. They entered the venue in order with enthusiasm and curiosity about the industry, kicking off a day of insightful exchanges.

The event specially invited Professor Lin Tingyu, distinguished professor of Shenzhen Polytechnic University, member of the 11th National Overseas High-level Talents, project leader and chief scientist of National Major Project 02. He delivered an informative sharing session to interpret cutting-edge advanced packaging technologies.

Centering on three core themes including TGV glass substrate, SiC embedded PCB diamond ceramic solution and 2.5D glass CoGoP technology, Professor Lin analyzed technical principles, industrial challenges and application prospects layer by layer, delivering valuable industry insights to all attendees.

Mr. Lin Xiaoxin, representative of Suneast, and Mr. Shimizu, consultant of Ruinace, shared innovative achievements and practical application cases of advanced packaging and testing equipment respectively. Their presentations showcased the solid strength of equipment manufacturers in niche sectors.

Unite as one, lead the future with intelligence! The event concluded successfully amid enthusiastic discussions. We witnessed the charm of cutting-edge technologies and the power of high-end equipment, while building a bridge for industrial communication and cooperation.

Going forward, Suneast will keep focusing on pain points and development trends of the semiconductor industry. More themed exchange events will be held to boost joint progress and collaborative innovation among enterprises, jointly driving the high-quality development of the semiconductor sector.