2026-05-25
From December 17 to 19, 2025, Suneast showcased its semiconductor equipment at the Japan Semiconductor Exhibition. The company displayed a full range of products covering the entire semiconductor packaging process. Its self-developed fully automatic pre-sinter die bonder, semiconductor oven, inline rapid curing oven and semiconductor printer maintain leading technological advantages in the industry.
Faced with the rapid development of the global semiconductor industry, Suneast has formulated a clear development blueprint. With the vision of becoming a global leader in SMT intelligent equipment and a champion in the segmented semiconductor equipment sector, the company strives to drive technological upgrading of the semiconductor and electronic manufacturing industries.
