2026-05-25
From November 18th to 21st, 2025,SUNEAST made a striking appearance at Productronica 2025 in Munich, Germany, drawing significant attention with our impressive range of products and innovative technologies.
We showcased several of our key solutions, including:Semiconductor Oven、IC Die Bonder、Semiconductor Printer、Lead-Free Reflow Oven、Online Selective Wave Soldering Machine. These products drew significant interest from professional attendees at the event.
In the field of semiconductor packaging, Suneast's IC die bonder WBD2200 PLUS delivered an impressive performance. The equipment supports multi-layer stacking, compatible with 8 to 12-inch wafers, and enables ultra-thin and ultra-small chip mounting. It also features advanced functions such as automatic loading and unloading as well as automatic wafer replacement.
At our booth, the SUNEAST team demonstrated their expertise by engaging international visitors and showcasing the cutting-edge technology, superior performance, and user-friendly operation of our equipment. The vibrant interactions and steady stream of clients for in-depth discussions clearly reflected the global market's increasing recognition and trust in China's high-quality electronic manufacturing equipment.
