2026-05-25
In this golden autumn season, we welcome NEPCON ASIA 2024, a grand event for the electronics manufacturing industry. As a professional supplier of SMT and semiconductor intelligent equipment, Suneast was invited to the exhibition. We discussed the latest industry trends and showcased technological innovations with professionals from across the globe.
During the three-day exhibition, Suneast presented its full lineup of flagship products. Numerous visitors, technicians and purchasing managers came to the booth to conduct in-depth discussions on product performance, application cases and future cooperation prospects. Notably, many overseas guests visited our stand. Our international sales staff received them warmly, boosting international exchanges and creating more foreign trade opportunities.
The booth was bustling and drew coverage from multiple media outlets. Company representatives elaborated on exhibited devices and latest products, shared future R&D plans and industry trends, fully demonstrating Suneast's forward-looking vision and innovative strength as an industry leader.
Suneast was invited to the SiP and Advanced Semiconductor Packaging & Testing Technology Forum. Wang Yaojun, Deputy R&D Director of the company, delivered a speech themed on Domestic Application of Suneast Semiconductor Packaging Equipment. He mainly introduced devices including IC bonders and semiconductor ovens, presenting the firm's innovation capacity and technical proficiency to the industry.
Through this exhibition, Suneast has demonstrated its technological strength and innovation capability to the industry. More importantly, we gained valuable recognition and support. Going forward, we will further increase R&D investment, optimize product portfolio and deepen cooperation with clients, jointly driving the development of electronics manufacturing and semiconductor industries.
