2026-05-25
From March 20 to 22, 2024, the three-day Productronica China concluded successfully at Shanghai New International Expo Centre. The exhibition showcased technological advances and product trends across the electronic manufacturing industry chain, as well as the development ecosystem and competitive landscape of the electronics sector.
Suneast made a stunning appearance with precision welding equipment and newly-launched products. Closely integrating technological R&D with industrial application, the company demonstrated its strength and potential in precision welding and high-end equipment sectors, drawing widespread industry attention and keeping the booth bustling with visitors.
Suneast showcased full-nitrogen reflow soldering and selective wave soldering precision welding equipment at the exhibition. Both gained wide recognition for outstanding performance in SMT and DIP precision welding processes.
Full-nitrogen reflow soldering is applied to high-precision and high-reliability welding of mobile phones, automotive electronics, mini LEDs and semiconductor chips. Adopting full nitrogen protection with independent nitrogen control in each temperature zone and low oxygen level inside the furnace, it prevents component oxidation during soldering and guarantees superior welding quality.
Selective wave soldering is mainly used for through-hole soldering of multi-layer PCBs in military, automotive electronics, automatic control and other fields with stringent soldering requirements and complex processes. Soldering parameters of each joint can be customized freely. Ample process adjustment margin helps optimize parameters to the best state, effectively reducing defect rates.
The newly unveiled semiconductor oven, launched domestically for the first time at the exhibition, marks another key innovative product of Suneast.This nitrogen-filled oven is applicable to the baking and curing of semiconductor wafers, IC packages, glass substrates and other products. Featuring a fully sealed inner cavity and thousand-class cleanroom aging test standard, it maintains oxygen content below 100PPM inside the chamber. With high-precision temperature control up to 0.5°C, it fully meets high-performance requirements of semiconductor products.
Suneast's semiconductor packaging IC bonding machine is widely applied in automotive electronics, medical electronics, optoelectronics, mobile phones and other fields. It is compatible with 8-inch to 12-inch wafers and capable of mounting ultra-thin and ultra-small chips. The equipment supports multi-layer stacking, automatic nozzle replacement, as well as automatic loading, unloading and wafer switching.
Staff at Suneast's booth carefully listened to clients' demands and responded professionally. Technical specialists delivered vivid and intuitive on-site equipment demonstrations. Eye-catching exhibits, immersive experience and thoughtful service greatly aroused visitors' enthusiasm.
Suneast's professionalism displayed at the exhibition has won praise from the industry and customers. We will keep focusing on client demands, strive for breakthroughs in core technologies and deliver beyond-expectation service experience.
