With the rapid development of electronic technology, as a convenient communication tool, mobile phones constantly give people a new way of life, which can realize a variety of life needs, like entertainment, shopping, social communication, travel and so on. The screen of mobile phone is getting bigger and bigger, but its core "chip" is getting thinner and smaller, which puts forward extremely stringent requirements for the back-end packaging and curing of mobile phone chip. The traditional curing process and equipment has low efficiency, capacity, yield, and degree of automation, which cannot meet the high quality, high yield and high efficiency of cell phone chip curing.

     In view of the above weaknesses, Suneast Technology developed online vertical oven innovatively, which can realize online automatic production, precise temperature control, bring high efficiency and high yield packaging and curing solutions for mobile phone chip packaging manufacturers, which fully meet the requirements of the current mobile phone small size, large quantity and high quality chip packaging and curing requirements.

High automation, high production efficiency, greatly reduce labor

      Suneast online vertical oven, with high automation, its production efficiency is much higher than the traditional curing oven, especially for products requiring long curing time in the oven, it can effectively improve production capacity, the market demand for vertical oven is increasing, replacing the traditional curing oven, has become a trend.

      The inlet and outlet side are equipped with standard SMEMA communication interface, connected to the previous and next devices, automatic control of the board in/out. Double lifting design for transmission system, large number of storage boards, can meet the high efficiency of production requirements. There’re 12 heating modules in the front and rear sides with high thermal compensation efficiency; each module can independently control the temperature and monitor the temperature change in real time to ensure that the temperature deviation in the oven is ≤±2℃. It avoids many drawbacks of traditional packaging process and equipment, such as the traditional curing equipment needs manual operation, heavy workload, low efficiency, inconsistent curing quality and other problems.

Precise temperature control, excellent performance, reliable quality

      Suneast online vertical oven can store large number of boards with accurate temperature control can meet the process requirements of mobile phone chip package curing, so as to make the baking, curing performance is better, with high quality consistency. Imported optical fiber sensor is adopted for board conveying detection in the chamber to ensure operation reliability to be maximum. The pushing mechanism adopts high precision stepping motor control, to ensure the accuracy of board pushing.

Small floor area, high cleanliness, convenient maintenance

      This oven, with compact structure, small floor area covering, for same productivity, it saves workshop space greatly comparing with the traditional horizontal curing oven. Equipped with exhausting outlet, it keeps the air in the chamber clean, which can meet the requirements of ten thousand class cleanliness production environment. The top of the machine is provided with a fast air outlet for cooling, which can quickly cool the temperature in the furnace if the equipment is abnormal, so as to inspect the machine easily; the exhaust air outlet is configured to keep the air in the furnace chamber clean. Glass Windows are installed on the inlet side and outlet side of the equipment to facilitate real-time observation of the operating conditions in the oven.

     The traditional horizontal packaging curing equipment has some problems, such as low automation, large footprint, high labor cost and unstable quality. After years of research and development improvement, testing and application inspection, Suneast Technology has launched a more stable and reliable online vertical curing oven. The device is not only suitable for the packaging and curing of the back end of the mobile phone chip, but also can be used in the production links requiring heat curing such as chip bonding, bottom filling and component packaging.