2022-07-12
On 7th July, Suneast technology was invited to attend the 76th CEIA China Electronic Intelligent Manufacturing Summit held in Chengdu. More than 400 representatives from a number of enterprises in Chengdu and its surrounding areas gathered with advanced manufacturing equipment manufacturers from all over the country to carry in-depth discussions on precision manufacturing and high reliability technology.
Lin Yang, sales Director of Suneast Technology, brought the keynote speech "Application of Full Nitrogen Filled Reflow Oven" at the conference, and shared the application scheme of full nitrogen filled reflow welding in MiniLED and semiconductor packaging.
The rapid development of MiniLED technology in recent years has brought great opportunities to the market and great challenges to the production technology. Especially, it is one of the difficult problems in MiniLED packaging to realize stable and reliable chip and substrate welding. The pads of MiniLED are small and there’s a large number of solder joints, there are high requirements for hot air/cooling air flow control, temperature uniformity, nitrogen protection, oxygen content in the furnace and so on. Suneast technology has continued to study MiniLED production process. With years of welding technology experience, Suneast technology has broken through many difficulties and developed full nitrogen filling reflow welding equipment that can meet MiniLED welding requirements. We will introduce it in detail in the next article.
Special technical requirements for semiconductor packaging chip welding, such as welding temperature/time, temperature rising/falling slope, PPM value and cleanliness, and so on, Suneast technology specifically made the reflow soldering equipment for semiconductor industry, the max temperature is more than 350 ℃, the PPM value is controlled under 500 PPM, and it has the function for real-time monitoring of temperature and PPM, which can be used in high cleanliness of the production environment.
