Curing characteristics and process requirements for back-end packaging of mobile phone chips:

     Mobile phone is an electronic product that modern people cannot separate from it, which is used for communication, consumption, transportation, work and so on. The screen of mobile phone is getting bigger and bigger, but its core "chip" is getting thinner and smaller, which puts forward extremely stringent requirements for the back-end packaging and curing of mobile phone chip. The traditional curing process and equipment cannot meet the high quality, high yield and high efficiency of cell phone chip curing.

     Suneast Technology online vertical curing oven solution:　　

     Due to its small size, large quantity and high requirements, our vertical curing oven is especially suitable for mobile phone production line.

     Suneast online vertical oven, with compact structure, small footprint, it saves workshop space greatly; high production efficiency, much higher than the traditional curing oven, especially for products requiring long baking time in the oven, it can effectively improve production capacity, the market demand for vertical oven is increasing, replacing the traditional curing oven, has become a trend.　

     Suneast online vertical oven adopts double lifting design, large number of storage boards and accurate temperature control can meet the requirements of various temperature profiles curing process.

     Suneast Vertical oven has the following characteristics for the packaging curing of the back end of mobile phone chips:

1. Double lifting design for transmission system, large number of storage boards, can meet the high efficiency of production requirements.

2. Imported optical fiber sensor is adopted for board conveying detection in the chamber to ensure operation reliability to be maximum.

3. There’re 12 heating modules in the front and rear sides with high thermal compensation efficiency; each module can independently control the temperature and monitor the temperature change in real time to ensure that the temperature deviation in the oven is ≤±2℃.

4. Equipped with standard SMEMA communication interface, connected to the previous and next computers, automatic control of the board.

5. The push board mechanism adopts high precision stepping motor control, to ensure the accuracy of board pushing.

6. The top of the machine is equipped with an opening for fast air exhausting and cooling, which can quickly cool the temperature in the oven; if the equipment is abnormal, so as to facilitate inspection; the exhaust air outlet is equipped also to keep the air in the furnace clean.

7. Glass Windows are installed on the inlet side and outlet side of the equipment to facilitate real-time observation of the operating conditions in the oven.

8. Suneast online vertical oven is not only suitable for the packaging and curing of the back end of mobile phone chips, but also used in the production of chip bonding, bottom filling, component packaging and other hot curing processes.