Case details
Semiconductor industry characteristics and reflow oven process requirements:
In order to meet the high density, low void content, and miniaturization design requirements of the electronic products, the packaging welding quality is becoming more and more high, many electronics manufacturers require to semiconductor reflow oven, to make the solder paste printed on the convex metal surface to be reflowed into ball shape, and make the tin ball combined with the base board, and then the chip is joint to the integrated circuit boards, It is also needed to weld the chips and circuit boards together, so it is essential for chip packaging and the manufacturing of integrated circuits.
The represents customers of semiconductor chip welding, such as ASE, Tianshui Huatian, STS, etc.
Semiconductor chip belongs to small size product, the welding pad particles are small, and so it has higher requirements for welding transport system stability, hot air volume control, cooling air volume control, hot air temperature uniformity, nitrogen protection, furnace oxygen content uniformity and so on.
Suneast semiconductor reflow oven solutions:
For semiconductor chip welding, it has high requirement for the empty rate for welds, solder joint shapes, and solder joint surface brightness, so the uniformity for semiconductor reflow soldering temperature control, nitrogen protection, oxygen content control, the stability of the transportation and so on are especially important for the semiconductor reflow oven, otherwise it may cause some solder joints virtual welding, the surface may has a concave points, empty rate may be higher, solder joints offset, Irregular shape and other undesirable phenomena, which cannot meet the requirements of welding process.
Suneast reflow oven has the following characteristics for the semiconductor industry:
1. Mesh belt transmission, stable, reliable, easy to maintain.
2. Multiple sections of independent temperature control, separate frequency converter control for each section, effectively control the volume of hot air in each section of the temperature area, to ensure the uniformity of temperature.
3. The whole process is filled with nitrogen, and nitrogen in each temperature zone can be adjusted independently to ensure that nitrogen in the furnace is uniform and reliable.
4. Three cooling zones, which are controlled by independent inverter, effectively control the cooling slope, and meet the process requirements.
5. Multi-point oxygen concentration detection in the furnace, real-time detection of oxygen content data in each process section of the furnace.
6. New flux recovery system, ensure flux recovery more thoroughly, keep the furnace clean, save maintenance time, reduce the cost of use.