Case details
Mini LED industry characteristics and reflow welding process requirements:
With the rapid development of Mini LED display technology, Mini LED display products have been applied to super large screen HD display, such as monitor and command, HD studio, high-end cinema, medical diagnosis, advertising display, conference and exhibition, office display, virtual reality and other commercial fields. Mini LED is a backlight technology. Compared with traditional LED, it has smaller particles, finer display effect and higher brightness. At the same time, it is more energy-efficient than traditional LED, and supports accurate dimming, which will not cause the problem of uneven backlight of LED. The product pad size between 50 to 200 μm.
Mini LED has higher requirements for hot air flow control, cooling air flow control, hot air temperature uniformity, nitrogen protection, uniformity of oxygen content in the furnace and so on, due to the small particle size of the pad.
Mini LED reflow oven solution:
Mini LED pads have large and small sizes. There are usually thousands of chips and tens of thousands of solder joints on each Mini LED circuit board to connect RGB tri-color chips. The big welding spots on the product bring very great difficulty to the chip packaging welding, for big size products with number of welding spots, the reflow soldering temperature uniformity control, nitrogen and oxygen content control, and other aspects are especially important, otherwise it may cause some welding point virtual welding, surface black, welding spots offset phenomenon, which cannot meet the welding process requirements.
Suneast technology reflow oven has the following characteristics for Mini LED industry:
1. Segmented independent temperature control, with separate inverter control, effectively control the volume of hot air in each section of the temperature area, to ensure the uniformity of temperature.
2. The whole process is filled with nitrogen, and the nitrogen in each temperature zone is adjusted independently to ensure that nitrogen in the furnace is uniform and reliable.
3. Upper and lower double cooling zone, with independent inverter control, effectively control the cooling slope.
4. Many oxygen concentration detection points in the furnace, real-time detection of oxygen content data in each process section of the oven.
5. New flux recovery system, ensure flux recovery more thoroughly, keep the furnace clean, save maintenance time, reduce the cost of use.
